Job Summary

IC Package Design Engineer with 5+ years experienced
•  Experienced in IC Package Design using Cadence APD Layout tool
•  Good understanding of package/substrate design and package assembly rules related to flip chip designs.
•  Should have expertise in constraint setting in layout tool.
•  Good knowledge on Signal and power integrity aspects of package layout design.
•  Exposure to different package technologies such as MCM, flip chip / wire bond, 3D, 2.5D etc., added advantage
•  Expertise in High-Speed Complex Package and PCB designs with HDI, Blind and Buried Via technologies
•  Hands-on expertise with PCB designs involving High Speed Parallel Bus interfaces including DDR, LPDDR, GDDR and HSIO interfaces including PCIe, SERDES.
•  Good Exposure to Stackup design, DFM, DFA rules and adherence.

Key Responsibilities

•  Hands-on expertise with PCB designs involving High Speed Parallel Bus interfaces including DDR, LPDDR, GDDR and HSIO interfaces including PCIe, SERDES.
•  Good Exposure to Stackup design, DFM, DFA rules and adherence.

Skill Requirements

1. Proficiency in packaging and shipping design concepts, including knowledge of materials, dimensions, and shipping regulations.
2. Strong cad design skills with expertise in autocad for creating 2d and 3d designs.
3. Ability to interpret technical drawings and translate them into viable packaging solutions.
4. Excellent project management skills to oversee multiple design projects simultaneously.
5. Good communication skills to interact with clients, team members, and stakeholders effectively.
6. Creative thinking and problem-solving abilities to develop innovative packaging designs.
7. Attention to detail and accuracy in design execution to meet client expectations.

Other Requirements

1.Relevant certifications in Packaging Design, CAD Design, or Autocad are a plus.