Job Summary

3-6 Years industry experience with  Mentor Expedition tools from setting up layout constraints, placement, routing and releasing to fab.Project requirements understanding, involve in High speed and High layer count PCB Design for complex circuit architectures / designs, Microstrip and stripline designs, stack-up designs.Experience with Type3 & Type4 PCB designs.Able to create symbol and footprint. Good experience with IPC Standards.Experience in HDI (Blind/Buried), stacked, staggered, back drilling, Flex design, Rigid Flex, RF circuit boards, micro-via technology is a must.Should have knowledge of IPC standards for PCB manufacturing activities, PCB assembly and Rigid PCB assembly.Experience with DDR3, SGMII, USB, SATA, PCIe, high speed, analog, RF, controlled impedance routing and High-Power boards.Should have thorough understanding of Signal Integrity aspects of PCB routing.   Good experience with CAM350/Valor (Gerber verification).Ability to read and understand electronic schematics.

Key Responsibilities

1. To collaborate with key stakeholders, to understand business objectives and work with them to integrate design thinking into software/product development.
2. To lead a team of designers, provide guidance, and ensuring the delivery of high-quality design solutions in alignment with the overall business goals.
3. To present design concepts and strategies to stakeholders and gather feedback.
4. To establish and maintain design standards, guidelines, and best practices.
5. To stay abreast of industry trends, emerging technologies to drive innovation and excellence in design.

Skill Requirements

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Other Requirements

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