Job Summary

As a Hardware Engineer within the ATE division, you will bridge the gap between silicon design and high-volume production. You will be responsible for the architecture, design, and validation of complex test interface hardware used to characterize and test next-generation high-power supply ICs (e.g., DC-DC controllers, gate drivers, and GaN/SiC-based solutions) on Teradyne platforms like the UltraFLEX or Eagle Test System.

Key Responsibilities

• ATE Interface Design: Architect and design high-complexity Device Interface Boards (DIBs/Load Boards) capable of handling high-power levels (high current/high voltage) while maintaining signal and power integrity.
• Analog & Power Supply Design: Develop on-board supporting circuitry, including precision analog signal conditioning, custom power regulation modules, and gate driver circuits required for ATE instrumentation.
• Simulation & Analysis: Perform extensive SPICE simulations (LTspice, SIMPLIS/SIMETRIX) to validate circuit behavior and conduct Power Integrity (PI) and Signal Integrity (SI) analysis to ensure robust performance under high-speed switching conditions.
• Cross-functional Collaboration: Partner with Silicon Design, Design-for-Test (DFT), and Product Engineering teams to define test concepts and hardware requirements for futuristic power controllers.
• Hardware Bring-up & Debug: Lead the hands-on electrical validation and troubleshooting of new test hardware using high-end lab equipment (oscilloscopes, power analyzers) to resolve thermal or noise issues in high-current paths.
• PCB Technology: Oversee high-layer count PCB design, selecting appropriate laminates and stack-ups to meet rigorous thermal and electrical isolation standards for high-power IC testing.

Skill Requirements

• Education: University degree in Electrical Engineering, Power Electronics, or a related field.
• Experience: 5+ years of experience in Power Electronics Design (e.g., DC-DC, AC-DC converters, or power modules) and Analog Circuit Design.
• ATE Expertise: Hands-on experience with Teradyne UltraFLEX or similar ATE platforms is highly preferred.
• Design Tools: Proficiency in EDA tools such as Altium Designer, Cadence Allegro, or Mentor Graphics.
• Technical Knowledge:
• Deep understanding of power semiconductor topologies (Buck, Boost, Flyback) and Wide Bandgap (GaN/SiC) technologies.
• Strong background in magnetic design, EMI filter design, and high-current PCB layout techniques.

Other Requirements