Job Summary
NPI, Support for engineering activities including prototypes and new product introduction.LaMP & LoCoW Manufacturing will need a multi-disciplinary team including hands-on operations in a Cleanroom for advanced packaging and testing. The technical expertise required to execute manufacturing processes for Laser-on-Module-Package (LaMP) and Laser-on-Carrier-on-Wafer (LoCoW) components
Key Responsibilities
Advanced Packaging & Assembly Expertise
· Photonic Packaging Engineers: Deep knowledge of flip-chip bonding, die-attach, and high-precision alignment (sub-micron level).
· Wafer Fab Technicians: Skilled in wafer dicing, grinding, and polishing, specifically for silicon-on-insulator (SOI) materials.
· Process Engineers: Specialists in Underfill and Encapsulation to ensure thermal and mechanical stability.
2. Electro-Optical Test Engineering
· Test Engineers (Optical/RF): Experience with L-I-V (Light-Current-Voltage) characterization and spectral analysis.
· Hardware-in-the-Loop (HIL) Specialists: Talent capable of operating automated test equipment (ATE) and handling fiber-optic coupling.
· Quality Assurance (QA) Metrology: Experts in Scanning Electron Microscopy (SEM) and Acoustic Microscopy.
3. Equipment & Cleanroom Operations
· Equipment Maintenance Engineers: Expertise in troubleshooting high-precision pick-and-place and assembly machinery.
· Yield Engineers: Focused on statistical process control (SPC) to maximize efficiency and reduce scrap.
· Cleanroom Operators: Certified staff experienced in contamination control (ISO Class 5/100) and ESD safety.
4. Engineering Support & NPI
· NPI Managers: To coordinate the transition from engineering prototypes to stable manufacturing.
· Materials Scientists: Specialized in thermal management for high-power laser modules.
Skill Requirements
Advanced Packaging & Assembly Expertise
· Photonic Packaging Engineers: Deep knowledge of flip-chip bonding, die-attach, and high-precision alignment (sub-micron level).
· Wafer Fab Technicians: Skilled in wafer dicing, grinding, and polishing, specifically for silicon-on-insulator (SOI) materials.
· Process Engineers: Specialists in Underfill and Encapsulation to ensure thermal and mechanical stability.
2. Electro-Optical Test Engineering
· Test Engineers (Optical/RF): Experience with L-I-V (Light-Current-Voltage) characterization and spectral analysis.
· Hardware-in-the-Loop (HIL) Specialists: Talent capable of operating automated test equipment (ATE) and handling fiber-optic coupling.
· Quality Assurance (QA) Metrology: Experts in Scanning Electron Microscopy (SEM) and Acoustic Microscopy.
3. Equipment & Cleanroom Operations
· Equipment Maintenance Engineers: Expertise in troubleshooting high-precision pick-and-place and assembly machinery.
· Yield Engineers: Focused on statistical process control (SPC) to maximize efficiency and reduce scrap.
· Cleanroom Operators: Certified staff experienced in contamination control (ISO Class 5/100) and ESD safety.
4. Engineering Support & NPI
· NPI Managers: To coordinate the transition from engineering prototypes to stable manufacturing.
· Materials Scientists: Specialized in thermal management for high-power laser modules.