Senior Designer
India
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Job Description
Senior Designer
Bangalore, Karnataka

Job Summary

  • IC Package Design Engineer with 3+ years experienced
  • Experience with Cadence Advanced Package designer, IC Package Design experience with Cadence APD Layout tool
  • Good understanding of package/substrate design and package assembly rules related to flip chip designs.

 

Key Responsibilities

  • Exposure to different package technologies such as MCM, flip chip / wire bond, 3D, 2.5D etc., added advantage
  • Expertise in High-Speed Complex Package and PCB designs with HDI, Blind and Buried Via technologies
  • Hands-on expertise with PCB designs involving High Speed Parallel Bus interfaces including DDR, LPDDR, GDDR and HSIO interfaces including PCIe, SERDES.
  • Good Exposure to Stackup design, DFM, DFA rules and adherence.
  • Should have expertise in constraint setting in layout tool.

 

Skill Requirements

IC Package Layout, Flip Chip, FcBGA, MLO design, MLC design, Cadence APD, Cadence Package Designer

 

Other Requirements

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Information at a Glance

Why HCLTech?

At HCLTech, you'll supercharge your potential. You'll find your career. And you'll find your spark. All at a place that knows that helping its customers stay on top starts by putting its people first.

HCLTech is a global technology company, home to more than 223,000 people across 60 countries, delivering industry-leading capabilities centered around digital, engineering, cloud and AI, powered by a broad portfolio of technology services and products. We work with clients across all major verticals, providing industry solutions for Financial Services, Manufacturing, Life Sciences and Healthcare, Technology and Services, Telecom and Media, Retail and CPG, and Public Services. Consolidated revenues as of 12 months ending June 2026 totaled $14.8 billion.