Job Summary
The Mechanical Engineer – Core Design plays a key role in the design and development of semiconductor equipment, mechanical modules, sheet-metal structures, precision assemblies, and complex subsystems. The role requires strong expertise in UG NX, GD&T, Sheet Metal, Tolerance Stack-up, Semiconductor Fabrication Processes, Material Selection, SOM, and FEA (Structural & Thermal). This engineer will lead concept creation, detailed design, validation, and cross-functional collaboration to deliver high-quality mechanical solutions.
4-6 yrs hands-on experience in mechanical design engineering, preferably in semiconductor equipment, high-tech capital machinery, robotics, or precision systems
Bachelor’s or master’s degree in mechanical engineering or related field.
Key Responsibilities
Core Mechanical Design: Create detailed 3D models and assemblies using UG NX, develop innovative concepts, apply DFM/DFA principles, and conduct trade-off analysis.
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GD&T & Tolerance Engineering: Apply ASME Y14.5 standards, conduct 2D/3D tolerance stack-ups, and validate critical tolerances.
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Sheet Metal & Machined Component Design: Design enclosures, brackets, frames, and apply sheet-metal design rules including bend allowances and manufacturability.
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Semiconductor Fabrication Process Knowledge: Understand vacuum design, plasma interaction, thermal loads, contamination control, and process module interfaces.
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Material Selection & SOM: Select materials based on mechanical, thermal, chemical, and vacuum criteria; develop SOM documentation and risk analysis.
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FEA – Structural & Thermal: Perform structural/thermal analysis, evaluate static/dynamic loads, perform modal studies, and validate heat dissipation.
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Cross-Functional Collaboration: Work with electrical, systems, manufacturing, supply chain, and reliability teams; drive design reviews.
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Testing, Validation & Release: Support prototype builds, perform functional testing, implement ECOs, and release designs through PLM tools.
Skill Requirements
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UG NX (Expert Level)
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GD&T (ASME Y14.5)
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Sheet Metal Design and Drafting
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Tolerance Stack-up (Worst Case & Statistical)
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Structural & Thermal FEA (ANSYS/Abaqus)
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SOM Documentation Knowledge
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DFM/DFA Application
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PLM Tools (Teamcenter/Windchill)
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Semiconductor Fabrication Process Knowledge
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Material Selection for Vacuum & Cleanroom Applications
Other Requirements
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Strong communication and presentation abilities.
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Ability to lead technical discussions and decisions.
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Analytical problem-solving and root-cause analysis capability.
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Mentorship experience with junior engineers.