Senior Designer
China
Job Description
Senior Designer
Beijing, Beijing

Job Summary

The Memory Layout Engineer will develop and integrate full-custom layouts for digital and analog sections of MRAM memories. The role covers memory building blocks, top-level integration, parasitic extraction, physical verification, manufacturability, yield, and power/signal-integrity considerations. The successful candidate will combine strong hands-on layout execution with disciplined verification and cross-functional communication.Key ResponsibilitiesCreate P-cell-based layouts for digital and analog portions of MRAM memory designs.Develop physical layouts for bit-cell arrays, row decoders, column decoders, sense amplifiers, and input/output blocks.Integrate memory sub-blocks into complete top-level memory layouts while maintaining hierarchy, connectivity, and design intent.Perform layout parasitic extraction (LPE) and support layout modifications required to achieve performance targets.Execute physical verification, including Design Rule Check (DRC) and Layout Versus Schematic (LVS).Apply Design for Manufacturability (DFM) and Design for Yield (DFY) principles throughout layout implementation and sign-off.Analyze potential electromigration, IR-drop, power-integrity, and signal-integrity risks, and implement layout improvements as required.Develop or maintain productivity scripts in PERL, Shell, TCL, or Cadence SKILL where useful.Collaborate with circuit design, verification, and process teams to resolve layout issues and support design closure.Required QualificationsBachelor's degree in Electrical Engineering, Computer Engineering, or a related discipline.At least 5 years of relevant experience in IC or memory layout engineering.Practical experience with memory layout using Cadence Virtuoso and physical verification using Cadence Assura and/or Siemens Calibre.Understanding of memory compiler architecture and major memory sub-blocks.Experience in DRC, LVS, LPE, DFM, and EM/IR analysis.Strong analytical, troubleshooting, communication, and teamwork capabilities.Ability to work professionally in both Chinese and English.Preferred ExperienceHands-on MRAM memory layout experience.Experience with low-power, high-performance, or high-density SRAM design.Exposure to multiple semiconductor technology nodes.Experience with Cadence Voltus and Synopsys StarRC.Scripting experience in PERL, Shell, TCL, or Cadence SKILL.Search KeywordsMemory Layout • MRAM • SRAM • Cadence Virtuoso • Assura • Siemens Calibre • StarRC • Voltus • DRC • LVS • LPE • DFM • DFY • EM/IR

Key Responsibilities

The Memory Layout Engineer will develop and integrate full-custom layouts for digital and analog sections of MRAM memories. The role covers memory building blocks, top-level integration, parasitic extraction, physical verification, manufacturability, yield, and power/signal-integrity considerations. The successful candidate will combine strong hands-on layout execution with disciplined verification and cross-functional communication.Key ResponsibilitiesCreate P-cell-based layouts for digital and analog portions of MRAM memory designs.Develop physical layouts for bit-cell arrays, row decoders, column decoders, sense amplifiers, and input/output blocks.Integrate memory sub-blocks into complete top-level memory layouts while maintaining hierarchy, connectivity, and design intent.Perform layout parasitic extraction (LPE) and support layout modifications required to achieve performance targets.Execute physical verification, including Design Rule Check (DRC) and Layout Versus Schematic (LVS).Apply Design for Manufacturability (DFM) and Design for Yield (DFY) principles throughout layout implementation and sign-off.Analyze potential electromigration, IR-drop, power-integrity, and signal-integrity risks, and implement layout improvements as required.Develop or maintain productivity scripts in PERL, Shell, TCL, or Cadence SKILL where useful.Collaborate with circuit design, verification, and process teams to resolve layout issues and support design closure.Required QualificationsBachelor's degree in Electrical Engineering, Computer Engineering, or a related discipline.At least 5 years of relevant experience in IC or memory layout engineering.Practical experience with memory layout using Cadence Virtuoso and physical verification using Cadence Assura and/or Siemens Calibre.Understanding of memory compiler architecture and major memory sub-blocks.Experience in DRC, LVS, LPE, DFM, and EM/IR analysis.Strong analytical, troubleshooting, communication, and teamwork capabilities.Ability to work professionally in both Chinese and English.Preferred ExperienceHands-on MRAM memory layout experience.Experience with low-power, high-performance, or high-density SRAM design.Exposure to multiple semiconductor technology nodes.Experience with Cadence Voltus and Synopsys StarRC.Scripting experience in PERL, Shell, TCL, or Cadence SKILL.Search KeywordsMemory Layout • MRAM • SRAM • Cadence Virtuoso • Assura • Siemens Calibre • StarRC • Voltus • DRC • LVS • LPE • DFM • DFY • EM/IR

Skill Requirements

Other Requirements

Information at a Glance

Why HCLTech?

At HCLTech, you'll supercharge your potential. You'll find your career. And you'll find your spark. All at a place that knows that helping its customers stay on top starts by putting its people first.

HCLTech is a global technology company, home to more than 230,000 people across 60 countries, delivering industry-leading capabilities centered around digital, engineering, cloud and AI, powered by a broad portfolio of technology services and products. We work with clients across all major verticals, providing industry solutions for Financial Services, Manufacturing, Life Sciences and Healthcare, Technology and Services, Telecom and Media, Retail and CPG, and Public Services. Consolidated revenues as of 12 months ending September 2026 totaled $14.8 billion.