Job Summary

  Experience with Cadence Advanced Package designer, IC Package Design experience with Cadence APD Layout tool
•    Good understanding of package/substrate design and package assembly rules related to flip chip designs.
•    Exposure to different package technologies such as MCM, flip chip / wire bond, 3D, 2.5D etc., added advantage
•    Expertise in High-Speed Complex Package and PCB designs with HDI, Blind and Buried Via technologies
•    Hands-on expertise with PCB designs involving High Speed Parallel Bus interfaces including DDR, LPDDR, GDDR and HSIO interfaces including PCIe, SERDES.
•    Good Exposure to Stackup design, DFM, DFA rules and adherence.
•    Should have expertise in constraint setting in layout tool.

Key Responsibilities

1. Develop and implement low power rf systems for various applications, ensuring optimal performance and energy efficiency.
2. Design and test emi/emc solutions to meet regulatory requirements and ensure electromagnetic compatibility.
3. Optimize hvac systems for maximum efficiency, comfort, and cost-effectiveness.
4. Collaborate within team to integrate low power rf,emi/emc and hvac systems into larger projects.
5. Troubleshoot and resolve any issues related to low power rf, emi/emc, or hvac systems.
6. Stay updated on industry trends and technologies related to low power rf, emi/emc and hvac systems.

Skill Requirements

1. Proficiency in low power rf system design and implementation.
2. Strong knowledge of emi/emc design principles and practices.
3. Experience in optimizing hvac systems for energy efficiency and performance.
4. Ability to troubleshoot and resolve issues in low power rf, emi/emc, and hvac systems.
5. Good analytical and problem-solving skills.
6. Strong communication and collaboration abilities to work effectively in cross functional teams.

Other Requirements

1.Relevant certifications in low power rf design, EMI/EMC compliance, or HVAC systems are a plus.