Senior Technical Lead - FEA, ANSYS, Abaqus
United States
Apply now
Job Description
Senior Technical Lead - FEA, ANSYS, Abaqus
Alameda, California

Job Summary

Mechanical FEA Engineer

Role. Run structural, shock/vibration, and warpage simulations for the module; report against Meta acceptance criteria and correlate to test data.

Key Responsibilities

Responsibilities

● Static structural FEA — stiffener design iterations (rib layout, thickness, geometry, mounting locations, material) under mounting-pressure, gravity-sag and handling loads

● Shock and vibration (S&V) — random vibration, sine sweep and shock per transport and operational spec; verify modal separation and no fatigue or yield failure

● Staged warpage simulation — bare PCB, populated components and full PCBA, at room and high temperature; flag SMT risk against package warpage contours

● Deliverables — analysis plans, meshed models, result fields and warpage contours, each with a pass/fail report against Meta acceptance criteria

● Test correlation — shadow-moiré for warpage; shaker and drop for S&V

Skill Requirements

Must-have

● 5+ years structural FEA in electronics, PCBA, or semiconductor packaging

● Ansys and/or Altair / HyperMesh (final toolchain TBC)

● PCB / PCBA warpage simulation — CTE mismatch, reflow- and assembly-induced, room and high temperature

● Shock / vibration and drop analysis; modal and fatigue assessment

● Demonstrated test correlation — model versus measured, and closing the gap

● Able to execute defined load cases and report crisply against acceptance criteria

 

Nice-to-have

● Modeling board-to-board / supplier-to-supplier laminate variation — nominal models assume identical laminate data across suppliers, while real warpage varies significantly supplier to supplier; capturing that spread is a core capability

● Liquid-cooled module structures; cold-plate preload effects

● Advanced or composite stiffener materials

● Scripting for parametric sweeps (Python / APDL)

Other Requirements

Nice-to-have

● Modeling board-to-board / supplier-to-supplier laminate variation — nominal models assume identical laminate data across suppliers, while real warpage varies significantly supplier to supplier; capturing that spread is a core capability

● Liquid-cooled module structures; cold-plate preload effects

● Advanced or composite stiffener materials

● Scripting for parametric sweeps (Python / APDL)
Maximum Salary (US):  148000
Minimum Salary (US):  78000
Apply now
Information at a Glance

Why HCLTech?

At HCLTech, you'll supercharge your potential. You'll find your career. And you'll find your spark. All at a place that knows that helping its customers stay on top starts by putting its people first.

HCLTech is a global technology company, home to more than 223,000 people across 60 countries, delivering industry-leading capabilities centered around digital, engineering, cloud and AI, powered by a broad portfolio of technology services and products. We work with clients across all major verticals, providing industry solutions for Financial Services, Manufacturing, Life Sciences and Healthcare, Technology and Services, Telecom and Media, Retail and CPG, and Public Services. Consolidated revenues as of 12 months ending June 2026 totaled $14.8 billion. 

 

Compensation and Benefits

A candidate’s pay within the range will depend on their skills, experience, education, and other factors permitted by law. This role may also be eligible for performance-based bonuses subject to company policies. In addition, this role is eligible for the following benefits subject to company policies: medical, dental, vision, pharmacy, life, accidental death & dismemberment, and disability insurance; employee assistance program; 401(k) retirement plan; 10 days of paid time off per year (some positions are eligible for need-based leave with no designated number of leave days per year); and 10 paid holidays per year.