Job Summary

The OSAT Interface Manager will be the primary technical and program interface between HCLTech and OSAT partners for semiconductor package development, assembly, testing, qualification, yield improvement and production readiness.

The role will manage the end-to-end OSAT engagement and ensure that package, assembly and test activities meet product requirements, quality standards, schedule and cost objectives.

Key Responsibilities

1. OSAT Technical Interface

- Act as the primary technical interface with OSAT partners.

- Define and communicate package, assembly and test requirements.

- Coordinate package design and technical reviews with the OSAT.

- Review OSAT process capabilities against product requirements.

- Drive resolution of technical issues during package development and production.

2. Package & Assembly Development

- Support package selection and development, including QFN, QFP, BGA and other applicable package technologies.

- Define and review assembly requirements covering:

  - Die attach

  - Wire bonding

  - Leadframe/substrate

  - Molding

  - Marking

  - Singulation

  - Package inspection

- Review package drawings, BOM, assembly process flow and manufacturing documentation.

- Drive DFM and package manufacturability reviews.

3. OSAT NPI Management

- Manage OSAT activities from package definition through engineering builds and production release.

- Establish and track OSAT milestones and deliverables.

- Coordinate engineering sample and pilot builds.

- Ensure OSAT readiness for each NPI milestone.

- Manage schedule, dependencies, risks and corrective actions.

4. Assembly & Test

- Coordinate OSAT assembly and final test activities.

- Define and review test requirements and test flow.

- Coordinate test-program readiness and tester/interface requirements.

- Monitor assembly and test yield during engineering and production builds.

- Drive root-cause analysis and corrective actions for assembly/test issues.

5. Qualification & Reliability

- Coordinate package qualification and reliability activities with the OSAT.

- Develop and track qualification plans, schedules and reports.

- Support AEC-Q100 qualification for automotive products where applicable.

- Review reliability results and drive corrective actions.

- Coordinate activities including:

  - HTOL

  - HAST/uHAST

  - Temperature cycling

  - Moisture sensitivity

  - Mechanical/package reliability

  - Wire-bond reliability

  - Package integrity

6. Yield & Quality Management

- Monitor OSAT assembly and test yields.

- Establish yield targets and improvement plans.

- Lead OSAT failure analysis and corrective-action activities.

- Drive 8D/root-cause analysis for major quality issues.

- Monitor process excursions and ensure appropriate containment and corrective action.

- Drive continuous improvement of assembly and test processes.

7. Program & Commercial Management

- Manage OSAT project schedules, milestones and deliverables.

- Track OSAT NRE, tooling, assembly and test costs.

- Support OSAT capacity planning and production ramp.

- Participate in technical and commercial discussions with OSAT partners.

- Maintain OSAT risk and issue registers.

- Escalate critical technical, quality, cost and schedule issues

Skill Requirements

- 10+ years of experience in semiconductor packaging, assembly, product engineering, test or OSAT operations.

- Strong experience working directly with OSAT organizations.

- Experience with package technologies such as QFN, QFP, BGA or similar packages.

- Strong understanding of die attach, wire bonding, molding, leadframe/substrate, singulation, package inspection, final test and reliability qualification.

- Experience managing semiconductor NPI programs.

- Experience in yield improvement and semiconductor failure analysis.

- Automotive semiconductor/AEC-Q100 experience is desirable.

- Strong cross-functional communication and program-management skills

Other Requirements

- Experience with automotive semiconductor products.

- Experience working with OSATs such as ASE, Amkor, JCET, UTAC, SPIL or equivalent.

- Experience with QFN/QFP packages and wire-bond assembly.

- Experience taking semiconductor products from engineering build through qualification and production ramp.

- Ability to work across engineering, quality, procurement, operations and customer teams.