Job Summary
HCLTech is seeking an experienced ATMP Equipment SME to support the growth of its OSAT/ATMP Equipment Engineering business. The individual will serve as a subject matter expert for backend semiconductor manufacturing and advanced packaging technologies, supporting customer engagements, solution development, delivery excellence, and capability building across semiconductor manufacturing programs.
Key Responsibilities
- Act as the technical SME for OSAT/ATMP equipment engineering opportunities.
- Support customer discussions, technical workshops, proposals, RFIs, RFQs, and solution development.
- Prvide domain expertise for equipment installation, qualification, acceptance testing, and sustaining engineering activities.
- Support advanced packaging and backend manufacturing programs for global semiconductor customers.
- Develop reusable assets, deployment methodologies, SOPs, and best practices.
- Mentor engineers and support competency development within the Semiconductor Manufacturing organization.
- Work closely with OEMs, customers, delivery teams, and ecosystem partners to resolve technical challenges.
- Support the development of managed services and multi-shift delivery models for ATMP equipment support.
Skill Requirements
- 8-12 years of experience in Semiconductor Manufacturing, OSAT, ATMP, or Equipment Engineering.
- Strong expertise in Die Attach, Wire Bond, Flip Chip, Molding, Dicing, Test Equipment, or Handlers.
- Experience in equipment installation, qualification, troubleshooting, maintenance, and production ramp support.
- Strong understanding of semiconductor packaging and assembly processes.
- Customer-facing experience with strong communication and stakeholder management skills.
Other Requirements
- Experience in 2.5D/3D Packaging, Fan-Out Packaging, TCB, Hybrid Bonding, and HBM Packaging.
- Experience with ASMPT, K&S, Besi, DISCO, Advantest, or Teradyne equipment platforms.
Exposure to Greenfield OSAT/ATMP setup and commissioning. - Experience supporting high-volume manufacturing environments.